Sound Design Technologies is a leading designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, and a leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP). Sound Design's internal manufacturing and test capabilities service its Hearing Products and well as provide contract manufacturing for customers requiring ultra miniature packaging solutions. The major functions supported by the Manufacturing Operations include: Wafer Fabrication, Packaging Operations and Test Operations.

With a history of more than 35 years, Sound Design (previously Gennum Corporation’s Audio Division and Manufacturing Operations) has provided enabling technologies worldwide. Sound Design Technologies is headquartered in Burlington, Ontario, with additional offices in Ottawa. Additional information is available at www.sounddesigntechnologies.com.